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p ? 2 w w ts z p o b s w b g e f e a p ty ?? p roduct structur e 2 014 rohm co w w.rohm.com z 22111 ? 14 ? 0 o wer man a b uck- b s tep-d o w atch b d39001e k e neral desc r bd39001e buck-boos t secondary ldo, reset the bd39 0 as under v o e atures ? autom a regulat o input ? 3.3 v fi x regulat o ? 5 v fix e ? config u ? over c dc / d c dc / d c ldo: i n ? over v o ? reset f o ? windo w ? htqf p p plications ? microc o pical appli c ?? simplified cir c e : silicon mon o o ., ltd. all rights 0 01 a gement i b oost s o wn s dog t kv -c r iption kv-c is a t switching re step-down s w and wdt. 0 01ekv-c in c oltage, over v a tically control o r with 40 v r a x ed output se c o r with built-in e d output sec o u rable seque n urrent protect i c 1: adjustabl e c 2: integrate d n tegrated o ltage / unde r o r ldo, dc / w watchdog t p 48v package o ntroller for a u c ation circu _ buck-boost s + seconda r + seconda r c uit1 o lithic integrated reserved. c for aut o s witc h s witch t imer power mana gulator contr o w itching regul c ludes protec t v oltage, over led buck-boo s a ted v cc , dc / c ondary step- fet o ndary ldo n ce control i on e voltage with d r voltage dete c dc2 and wd t imer u tomotive it # # # s witching re g r y switching r r y ldo circuit ? thi s o motive m h ing r ing r e gement ic w o ller (dc / d c ator (dc / d c ion circuits, s c urrent and t s s t switching / dc2 and ld down switchi n external resis c tion t g ulato r r egulato r s product is not 1/52 m icrocont r r egul a e gula t w ith c 1), c 2), s uch sd. o n g s tors ke y pac si designed for pr o r oller a tor + t or + r y specificati o ? input voltag e (s t ? output volta buck - seco n seco n ? reference v buck - seco n seco n ? oscillation f r ? max output c seco n seco n ? stand-by c u ? operating t e ? aec-q100 q kage htqfp48v mplified circ u bu c + s + s o tection agains t tsz 0 ldo + r eset + o ns e range t artup voltag e g e - boost dc / d n dary dc / d c n dary ldo o ltage accura - boost dc / d n dary dc / d c n dary ldo r equency c urrent n dary buck d c n dary ldo u rrent e mperature ra n q ualified w 9. 0 it2 k switching r s econdary s w s econdary ld t radioactive ra y data apr.7 0 2201-0t3t 0 + + e needs to b e d c1 fb voltag c 2 a cy d c1 fb voltag c 2 2 c / dc2 n ge - 4 w (typ) d ( t 0 0 mm 9.00 r egulato r w itching regul o y s data sh eet .2014 rev.0 0 0 am00120- 1 4.0 v to 30 v e above 4.5 v e 0.8 v 3.3 v 5.0 v e 2 % 2 % 2 % 2 00 to 550 k h 900 m a 600 m a 0 a (ty p 4 0 c to 125 c t yp) h (ma x mm 1.00 m m a to r eet 0 1 1 -2 v v .) v v v % % % h z a a p ) c x ) m downloaded from: http:///
2/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 pin configuration (top view) pin description (note 1) short with gnd _ # # # pin no. symbol function pin no. symbol function 1 vo3 5 v output 25 en1 output on / off 2 n.c. not connected 26 t4 (note 1) test pin 3 vs3 supply voltage input for ldo 27 vreg internal power supply 4 vs2 supply voltage input for dc / dc2 28 ss1 soft start time setting for dc / dc1 5 vs2 supply voltage input for dc / dc2 29 comp1 error-amp output for dc / dc1 6 n.c. not connected 30 fb1 feedback for dc / dc1 7 sw2 dc / dc2 sw pin 31 rt frequency setting 8 sw2 dc / dc2 sw pin 32 gnd ground 9 n.c. not connected 33 rst2# reset output for dc / dc2 10 pgnd2 power ground 34 rst3# reset output for ldo 11 pgnd2 power ground 35 rs twd# reset output for wdt 12 ss2 soft start time setting fo r dc / dc2 36 ct reset delay 13 comp2 error-amp output for dc / dc2 37 rtw frequency setting for wdt 14 fb2 feedback for dc / dc2 38 clk clock input 15 vdd n-channel mosfet drive supply 39 enwd wdt on / off 16 outl n-channel mosfet drive 40 en3 output on / off for ldo 17 pgnd1 power ground 41 en2 output on / off for dc / dc2 18 n.c. not connected 42 seq3 sequence setting for ldo 19 vl pch fet gate clamp for dc / dc1 43 seq2 sequence setting for dc / dc2 20 n.c. not connected 44 pg3 power good output for ldo 21 outh n-channel mosfet drive 45 pg2 power good output for dc / dc2 22 n.c. not connected 46 pg1 power good output for dc / dc1 23 cl overcurrent detection setting for dc / dc1 47 t3 (note 1) test pin 24 vcc supply voltage input 48 sel_uvlo select pin for vcc uvlo downloaded from: http:///
3/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 block diagram downloaded from: http:///
4/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 absolute maximum ratings (ta = 25 c) parameter symbol limits unit vcc voltage (note 1) v cc 40 v vs2 voltage (note 1) v s2 40 v vs3 voltage (note 1) v s3 40 v cl voltage v cl vcc v en1 voltage v en1 vcc v vreg voltage v reg 7 v vdd voltage v dd 7 v ss1, ss2 voltage v ss1 , v ss2 vreg v rst2#, rst3#, rstwd# v rst2# , v rst3# , v rstwd# 7 v clk, rtw, ct, enwd v clk , v rtw , v ct , v enwd 7 v pg1, pg2, pg3 v pg1 , v pg2 , v pg3 7 v en2, en3 v en2 , v en3 vreg v seq2, seq3 v seq2 , v seq3 7 v power dissipation (note 2) pd 5.0 w storage temperature range tstg -55 to +150 c junction temperature tjmax 150 c (note 1) pd should not be exceeded. (note 2) if mounted on a standard rohm 4 layer pcb (copper fo il area: 70 mm 70 mm) (standard rohm pcb size: 70mm 70 mm 1 .6mm) reduce by 9.6 mw / c (ta 25 c) caution: operating the ic over the abso lute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as ad ding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating rating parameter symbol maximum ratings unit min max voltage power supply v cc (buck boost mode) 4 (note 1) 30 v v cc (buck mode) 6 30 v v s2 5 10 v v s3 5 10 v oscillation frequency f osc 200 550 khz wdt oscillation frequency f oscw 50 250 khz outh current ability i outh - 1.5 a outl current ability i outl - 1.5 a sw2 current ability i sw2 - 900 (note 2) ma v o3 current ability i vo3 - 600 (note 2) ma operating temperature ra nge topr -40 +125 c (note 1) initial startup is over 4.5 v (note 2) pd should not be exceeded. downloaded from: http:///
5/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 electrical characteristic (unless otherwise specified: -40 c ta +125 c, 4 v v cc 30 v, 5 v v s2 10 v, 5 v v s3 10 v) parameter symbol limits unit condition min typ max all standby current 1 i st1 - 0 10 a ta = 25 c standby current 2 i st2 - - 30 a ta = 125 c circuit current i vcc 5 8 12 ma rt = 33 k ? , fb1 = 1.0 v oscillation frequency f osc 315 350 385 khz rt = 33 k ? vreg output voltage v reg 3.0 3.5 4.0 v vdd output voltage v dd 4.5 5 5.5 v vcc = 12 v uvlo_vcc detection voltage 1 v uvlovcc1 3.30 3.60 3.90 v sel_uvlo = open uvlo hysteresis voltage 1 v uvvcchys1 200 400 600 mv sel_uvlo = open uvlo_vcc detection voltage 2 v uvlovcc2 5.27 5.58 5.89 v sel_uvlo = gnd uvlo_vcc release voltage 2 v uvvccre2 5.35 5.67 6.0 v sel_uvlo = gnd uvlo hysteresis voltage 2 v uvvcchys2 50 75 - mv sel_uvlo = gnd en1 l threshold v en1l - - 0.5 v en1 h threshold v en1h 2.5 - - v en1 input resistance r en1 180 375 570 k ? vcc = 5 v sel_uvlo threshold v sel_uvlo - v reg / 2 - v sel_uvlo output current i sel_uvlo 5 14 23 a sel_uvlo = 0 v dc / dc1 (buck - boost dc / dc controller) fb1 voltage vref08 0.784 0.800 0.816 v fb1 = comp1 fb1 input bias current i fb1 -1 0 +1 a fb1 = 0.8 v soft start quick charge current i ss0 55 110 165 a soft start charge current i ss1 5 10 15 a soft start selected voltage v ss0 0.3 0.7 1.5 v soft start end voltage 1 v ss1 - v ss0 + v re f 0 8 - v soft start cramp voltage v sscl1 2.2 2.8 3.3 v ss1 = open vcc - vl voltage v l 8 10 12 v vcc 12 v vcc - vl hi - side outh on - resistance r onhh - 1.7 - ? vcc = 12 v outh - vcc lo - side outh on - resistance1 r onhl1 - 3 - ? vcc = 12 v outh - vl lo - side outh on - resistance2 r onhl2 - - 30 ? vcc = 4 v outh - pgnd hi - side outl on - resistance r onlh - 18 - ? vcc = 12 v lo - side outl on - resistance r onll - 22 - ? vcc = 12 v over current detection cl voltage (low) v cl_l 86 100 114 mv vcc - cl voltage, vcc = 12 v over current detection cl voltage (high) v cl_h 172 200 228 mv vcc - cl voltage, vcc = 12 v maximum on duty (outl) t on - 92 - % f osc = 600 khz downloaded from: http:///
6/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 electrical characteristic - continued parameter symbol limits unit condition min typ max dc / dc2 (secondary dc / dc) output voltage 2 v o2 3.23 3.30 3.37 v under voltage detection voltage v rst2 3.00 3.07 3.14 v under voltage hysteresis voltage v rsth2 20 - 80 mv soft start charge current i ss2 5 10 15 a ss2 = 0.2 v soft start end voltage 2 v ss2 0.6 0.8 1.0 v sw2 on - resistance h r onh2 - 0.3 0.6 ? sw2 on - resistance l r onl2 - 0.3 0.6 ? en2 threshold voltage v en2 0.6 0.8 1.0 v en2 charge current i en2 4 8 12 a en2 = 0.2 v uvlo_vs2 detection voltage v uvlovs2 3.5 3.9 4.3 v uvlo_vs2 hysteresis voltage v uvvs2hys 0.2 0.35 0.5 v ldo (5.0 v output ldo) output voltage 3 v o3 4.90 5.00 5.10 v 6.0 v vs3 10 v, 5 ma i v o 3 600 ma drop voltage v o3 - - 0.6 v vs3 = 4.65 v, i vo3 = 600 ma under voltage detection voltage v rst3 4.50 4.625 4.75 v under voltage hysteresis voltage v rsth3 30 - 150 mv vcc uvlo - ldo lvd difference voltage v lvd3 0.7 0.9 1.5 v v ulovvcc2 - v rst3 en3 threshold voltage v en3 0.6 0.8 1.0 v en3 charge current i en3 4 8 12 a en3 = 0.2 v uvlo_vs3 detection voltage v uvlovs3 3.5 3.9 4.3 v uvlo_vs3 hysteresis voltage v uvvs3hys 0.2 0.35 0.5 v vs3 over voltage detection voltage v ovvs 12.5 14 15.5 v downloaded from: http:///
7/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 electrical characteristic - continued parameter symbol limits unit condition min typ max rst2#, rst3#, rstwd# reset delay time t rst 30 56 160 ms ct = 0.47 f reset l voltage 1 v rstl1 - - 0.25 v v o3 = 1.0 v, irst = 100 a reset l voltage 2 v rstl2 - - 0.4 v i rst = 1 ma reset response time t phl - - 5 s rst# pull up resistance 4.7 k ? wdt oscillation frequency f oscw 75 100 125 khz r tw = 51 k ? clk fast ng threshold t wf 507 f oscw 512 f oscw 517 f oscw s clk slow ng threshold t ws 6635 f oscw 6655 f oscw 6675 f oscw s wdt reset time t wres 123 f oscw 128 f oscw 133 f oscw s clk l threshold v clkl - - 0.8 v clk h threshold v clkh 2.0 - - v enwd l threshold v enwdl - - 0.8 v enwd h threshold v enwdh 2.0 - - v rstwd on resistance r rstwd 50 100 200 ? i rstwd = 100 a pg1, pg2, pg3 pg on - resistance r pg1 r pg2 r pg3 0.5 1.0 2.0 k ? pg1 under voltage detection voltage v lvpg1 0.62 0.67 0.72 v fb1 voltage pg1 under voltage hysteresis v lvph1 20 - 100 mv fb1 voltage pg1 over voltage detection voltage v ovpg1 0.88 0.94 1.00 v fb1 voltage pg1 over voltage hysteresis v ovph1 20 - 100 mv fb1 voltage pg2 under voltage detection voltage v lvpg2 3.00 3.07 3.14 v fb2 voltage pg2 under voltage hysteresis v lvph2 20 - 80 mv fb2 voltage pg2 over voltage detection voltage v ovpg2 3.45 3.53 3.60 v fb2 voltage pg2 over voltage hysteresis v ovph2 20 - 80 mv fb2 voltage pg3 under voltage detection voltage v lvpg3 4.50 4.625 4.75 v v o3 voltage pg3 under voltage hysteresis v lvph3 30 - 150 mv v o3 voltage pg3 over voltage detection voltage v ovpg3 5.25 5.38 5.50 v v o3 voltage pg3 over voltage hysteresis v ovph3 30 - 150 mv v o3 voltage seq 2, seq 3 seq2 on resistance r seq2 0.5 1.0 2.0 k ? i seq2 = 100 a seq3 on resistance r seq3 0.5 1.0 2.0 k ? i seq3 = 100 a reset response time (t phl ) ? ? ? ? ? ? uvlo, rst# delay time fb2, rst2# delay time vo3, rst3# delay time downloaded from: http:///
8/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 0.780 0.785 0.790 0.795 0.800 0.805 0.810 -40 -10 20 50 80 110 fb1 voltage 1: vref08 [v] ambient temperature: ta [c] 3.23 3.25 3.27 3.29 3.31 3.33 3.35 3.37 -40 -10 20 50 80 110 output voltage2: v o2 [v] ambient temperature: ta [c] typical performance curves figure 1. standby current vs. temperature figure 2. circu it current vs. temperature figure 3. fb1 voltage vs. te mperature figure 4. output voltage2 vs. temperature 0 2 4 6 8 10 -40 -10 20 50 80 110 stundby current: istb [ a] ambient temperature: ta [c] 5.00 6.00 7.00 8.00 9.00 10.00 11.00 12.00 -40 -10 20 50 80 110 circuit current: i cc [m a] ambient temperature: ta [c] downloaded from: http:///
9/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 typical performance curves - continued 75 85 95 105 115 125 -40 -10 20 50 80 110 wdt frequency: f oscw [khz] ambient temperature: ta [c] 0.5 1.0 1.5 2.0 2.5 -40 -10 20 50 80 110 en1 threshold: en1 [v] ambient temperature: ta [c] 4.9 5.0 5.0 5.1 5.1 -40 -10 20 50 80 110 output voltage3: v o3 [v] ambient temperature: ta [c] 315 325 335 345 355 365 375 385 -40 -10 20 50 80 110 frequency: f osc [khz] ambient temperature: ta [c] figure 5. output voltage3 vs. temperat ure figure 6. frequenc y vs. temperature figure 7. wdt frequency vs. temperature figure 8. en1 threshold vs. temperature downloaded from: http:///
10/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 typical performance curves - continued 4.5 4.6 4.6 4.7 4.7 4.8 -40 -10 20 50 80 110 under voltage detection3: v rst3 [v] ambient temperature: ta [c] figure 9. vcc uvlo threshold voltage1 vs. temperature figure 10. vcc uvlo threshold voltage2 vs. temperature 3.3 3.4 3.5 3.6 3.7 3.8 3.9 -40 -10 20 50 80 110 vcc uvlo threshold voltage1: v uvlovcc1 [v] ambient temperature: ta [c] 5.37 5.42 5.47 5.52 5.57 5.62 5.67 5.72 5.77 -40 -10 20 50 80 110 vcc uvlo threshold voltage2: v uvlovcc2 [v] ambient temperature: ta [c] figure 11. under voltage detection2 vs. temperature figure 12. under voltage detection3 vs. temperature 3 3.02 3.04 3.06 3.08 3.1 3.12 3.14 -40 -10 20 50 80 110 under voltage detection2: v rst2 [v] ambient temperature: ta [c] downloaded from: http:///
11/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 typical performance curves - continued figure 13. outh high ron vs. temperature fi gure 14. outh low ron1 vs. temperature figure 15. outl high ron vs. temperature figure 16. outl low ron vs. temperature 0.5 1.0 1.5 2.0 2.5 -40 -10 20 50 80 110 outh high ron r onhh [ohm ] ambient temperature: ta [c] 1.5 2 2.5 3 3.5 4 4.5 -40 -10 20 50 80 110 outh low ron1 r onhl1 [ohm ] ambient temperature: ta [c] 17 18 19 20 21 22 23 -40 -10 20 50 80 110 outl high ron: v onlh [ohm ] ambient temperature: ta [c] 16.0 17.0 18.0 19.0 20.0 21.0 22.0 -40 -10 20 50 80 110 outl low ron: r onll [ohm ] ambient temperature: ta [c] downloaded from: http:///
12/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 typical performance curves - continued figure 17. sw2 high ron vs. temperature figure 18. sw2 low ron vs. temperature 0.1 0.2 0.3 0.4 0.5 0.6 -40 -10 20 50 80 110 sw2 high ron: r onh2 [ohm ] ambient temperature: ta [c] 0.1 0.2 0.3 0.4 0.5 0.6 -40 -10 20 50 80 110 sw2 low ron: r onl2 [ohm ] ambient temperature: ta [c] downloaded from: http:///
13/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 description of blocks ? under voltage lockout circuit (vcc_uvlo) this is a low voltage error prevention circuit. in case of sel_uvlo = open, if the v cc drops below 3.6 v (typ), the vcc_uv s lo is activated and the output circuit shuts down. in case of sel_uvlo = gnd, if the vcc drop s below 5.58 v (typ), the vcc_uvlo is activated and the output circuit shuts down. ? thermal shut down (tsd) the tsd protects the dev ice from overheating. if the chip temperature (tj) reaches 1 75 c (typ), the circuit shuts down ? over voltage detection (ovd) if dc / dc1, dc / dc2 and ldo output voltage ex ceed ovd, each pgood pin turns low. dc / dc1 ovd monitors fb1 voltage, dc / dc2 ovd monitors fb2 voltage and ldo ovd monitors v o3 voltage. pgood pin is an open drain output. and the pull up resistor should be connected to pgood for using this function. ? low voltage detection (lvd) if dc / dc1, dc / dc2 and ldo output voltage below lvd, each pgood pin turns low. dc / dc1 lvd monitors fb1 voltage, dc / dc2 lvd monitors fb2 voltage and ldo lvd monitors v o3 voltage. pgood pin is an open drain output, and the pull up resistor should be connected to pgood for using this function. ? under voltage lockout (vs_uvlo) vs_uvlo prevents error function at low vs voltage. if the vs2 or vs3 drops below 3.9 v (typ), the vs_uvlo is activated and the dc / dc2 or ldo is turned off. ? over current protection (ocp1_l, ocp1_h) dc / dc1 has two levels over current protection with different control system as shown below. 1) ocp1 low level operations in case the voltage between vcc and cl exceeds 100 mv (typ), ocp1 (low level operation) is activated and the switching pulse width of outh and the sw itching pulse width of outl are limited . also, if this pulse limited status continues during 256 clock times where the fb1 pin voltage drops below the under voltage detection level, the soft start pin capacitor is discharged and the outpu t is turned off during 8192 clock times. during the 8192 clock in which the output is turned off, the logic of outh and outl pin changes as follows; outh = h and outl = h. after the 8192 clock the chip re turns to normal operations and the soft start pin is recharged. 2) ocp1 high level operations in case the inter vcc - cl pin voltage exceeds 200 mv (typ), the chip goes into ocp1 high level operations, the soft start pin capacitor is discharged and the output is turned off for 8192 clk. during the 8192 clock in which the output is turned off, the logic of outh and outl pin changes as follows; outh = h and outl = h. after the 8192 clock the chip returns to normal operati ons and the soft start pin is recharged. figure 19. timing chart for dc / dc1 protection =,= =,= downloaded from: http:///
14/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 ~ dc / dc2 if output current of sw2 exceeds ocp, sw2 on dut y is limited and the output voltage is lowered. if fb2 voltage is below scp and after 256 clk (typ), dc / dc 2 is turned off. after 256 clk (typ), dc / dc2 returns to normal operation. figure 20. dc / dc2 over current protection ~ if the output current of ldo exceed ocp, the output current is limited and the output voltage is lowered. ? over voltage protection (vs3 ovp) ~ in case the vs3 voltage exceeds 14 v (typ), the chip goe s into vs3 ovp, the ss1 capacitor is discharged and the output is turned off for 8192 clock. during the 8192 clock in which the output is turned off, the logic of outh and outl changes as follows; outh = h and outl = h. after t he 8192 clock the chip returns to normal operations and the ss1 is recharged. all numerical values are typical. figure 21. vs3 over voltage protection = =,= downloaded from: http:///
15/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 rst#, rstwd# pin in case of enwd = l, rstwd# voltage is pull up voltage. in case of enwd = h, wdt operation starts. if wd t is in abnormal condition, rstwd# outputs ?l?. if v o2 or v o3 voltage is below the lvd, reset voltage (rst#) output is low. if both of v o2 and v o3 exceed the reset release voltage, ct is char ged. after tpor, reset voltage outputs high. figure 22. rst#, rstwd# logic circuit figure 23. rst2#, rst3# timing chart figure 24. timing chart (detection of lvd between reset) # # # downloaded from: http:///
16/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 ? oscillator for watch dog timer (foscw) this block creates a reference frequency of the watch dog timer. the oscillati on frequency is determined by the rtw resistance. the oscillation frequency can be set in the range of 50 khz to 250 khz. ? watch dog timer microcontroller ( c) operation is monitored with clk pin. window watch dog timer is included to enhance the assurance of the system. wdt starts operating when en wd becomes high. clk pin voltage must be low when enwd switches to high. wdt monitors both edges of clk pin (rising edge and falling edge). if width of both edges are shorter than fast ng or longer than slow ng, r stwd turns low for a wdt reset time (t wres ). since the width of fast ng and slow ng depends on a number of f oscw , fast ng and slow ng are variable by frequency of f oscw . if f oscw is unusual (ex. rtw is short to ground), r stwd turns low. in case of using rstwd, pull-up resister is needed because rstwd is an open drain. figure 25. witch dog timer state change diagram (wdt fsm) (1): standby mode, (2): normal mode, (3): microcontroller erro r detect, (4): osc_wdt error detect (see figure 25 wdt fsm) (5): when enwd is changed low to high, it is necessary that clk is low. figure 26. wdt timing chart standby mode rstwd=high osc_wdt err detect rstwd=low c err detect rstwd=low nomal mode rstwd=high wdt_clk error detection release os c _wdt e r ro r d e te ctio n po r= lo w or enwd=low fast ng or slow ng detection rstwd low range > twres por=low or enwd=low rstwd low range < twres osc_wdt error detection c error not detect (fast ng, slow ng not detect) # _ _ downloaded from: http:///
17/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 external components selection figure 27. application example 1 ?? downloaded from: http:///
18/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 ? (1) buck mode ? (vcc>>v o1 ) in case the input voltage is high co mpared to the output voltage, the chip will go into buck mode, resulting outh to repeatedly switch between h and l and that the outl will go to l (= off). this operation is the same as t hat of standard step-down switching regulators. shown below are the outh and outl waveforms on the right. on duty of pmos (d pon ), vcc and v o1 are shown in the following equation. vcc (eq. 1) (2) buck-boost mode ? (vcc v o1 ) in case the input voltage is close to t he output voltage, the chip will go into buck-boost mode, resulting both the outh and outl to repeatedly switch between h and l. concerning the outh, outl timing, the chip internally controls where the following sequence is upheld; when outh: h ? l, outl: h ? l. shown below are the outh and outl waveforms. ? vcc > v o1 ? vcc < v o1 figure 29 figure 30 *the timing excludes the sw delay the relationship between on duty of pmos (d pon ), on duty of nmos (d non ), vcc and v o1 is shown in the following equation. (eq. 2) the calculation formula of d pon and d non are shown in page 17. (3) boost mode ? (vcc << v o1 ) in case the input voltage is low compared to the output volta ge, the chip will go into boost mode, resulting outh to go to l (= on) and outl will repeatedly switch between h and l. this operation is the same as that of standard step-up switching regulators. max duty of outl is lim ited by internal circuit. on duty of nmos (d non ), vcc and v o1 are shown in the following equation. (eq. 3) figure 28 figure 31 downloaded from: http:///
19/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 (4) voltage for mode switching and duty control in the event of mode switching from boost to buck-boost or vi ce versa, mode switching input voltage is dependent on output voltage, the gain of inverting amp lifier and the cross duty. the general description is shown below. the duty of outh is controlled by outpu t of error amp (comp1) and slope voltage. also, outl duty is controlled by the outpu t voltage of the inverting amplifier in chip (boostcomp) and slope voltage. in case vcc = v o1 , comp1 voltage becomes equal to boostcomp voltage, and switching control timing of outh and outl becomes identical accordingly. figure 32. buck-boost operation controlled by comp1, boostcomp and slope voltage on duty of pmos in this condition is called the cross duty (dx = 0.85, typ). d pon and d non can be calculated by the following equation, assuming the gain of the in verting amplifier as a (1.5, typ). . . (note 1) (eq. 4) from eq.3, eq.4 and d pon = 1, the input voltage at transition between buck - boost and boost mode is calculated as follows; . ?? (note 1) (eq. 5) also, from eq.1, eq.4 and d non = 0, the input voltage at tr ansition between buck - boost and buck mode is calculated as follows; ? ? ? ? ? . (note 1) (note 1) a = 1.5 (typ), dx = 0.85 (typ) ?? be sure to confirm dx and a value under the actual application because these parameters vary depending on conditions of use and external components selected. dx varies with oscillating frequency shown in figure 33. in addition, ?a? value can be calculated by d non / d pon . boostcomp comp1 buck-boost boost buck cross duty 0% 85 %(typ) 100% slope vcc = vo1 (typ) 81 82 83 84 85 86 87 88 0 100 200 300 400 500 600 700 800 cross duty [%] oscillating frequency [khz] pmos: rsd080p05 nmos: rsd150n06 figure 33. cross duty vs. frequency characteristics downloaded from: http:///
20/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 1. setting the output l1, l2 value (dc / dc1, dc / dc 2) it is necessary to use lc filter. the use of big inductor helps lower the inductor ripple current and output ripple voltage, ev en though cost is higher and size is bigger. the inductance is shown in the following equation. the coil value significantly influences the output ripple curren t. thus, as seen bellow, the larger the coil is and the higher the switching frequency is, the lower the ripple current is. the optimal output ripple cu rrent setting is 30 % of maximum current. ~ dc / dc1 (at buck - boost) buck mode buck-boost mode boost mode ? vcc > v o1 ? vcc < v o1 ? ? i l : ripple current, i & l : average coil current, f: oscillating frequency d pon : pmos on / . / . d noff : nmos off C . . ~ dc / dc1 (at buck) ? ( v cc max : maximum input voltage, i l : inductor ripple current, v o : output voltage 1, f sw : oscillating frequency) ~ dc / dc2 (at boost) ? ( v s (max) : maximum input voltage, i l : inductor ripple current, v o : output voltage 2, f sw : oscillating frequency) an output current in excess of the coil current rating will caus e magnetic saturation to the coil and decrease efficiency. the following equation shows the peak current i lmax assuming the efficiency as . it is recommended to secure sufficient margin to ensure that the peak current does not exceed the coil current rating. use low resistance (dcr, acr) coils to minimize coil loss and increase efficiency. downloaded from: http:///
21/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 i olimit i o1 when load current is low, dc / dc1 operates discontinuously so set i l in a way it operates continuously (i l1 keeps continuously flowing). the condition of continuous operation is shown in the following equation. ~ dc / dc1 ?????? ?? (i o1 : load current) figure 36. over current detection shielded type inductor (closed magnetic circuit) is recomm ended. open magnetic circuit type inductor can be used for low cost applications if noise is not of concern. but in this ca se, there is magnetic field radiation between the parts and thus keep enough spacing between the parts. for ferrite core inductor type, please note that magnetic saturation may occur. saturation needs to be avoided at all times. precautions must be taken into account on the given provisions of the current rating because it differs according to each manufacturer. please confirm the rated current at t he maximum ambient temperat ure of the application to the coil manufacturer. i o1 i o1 sw1 sw1 i l1 figure 34. continuous operation figure 35. discontinuous operation downloaded from: http:///
22/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 2. setting the output capacitor c vo1 , c vo2 value (dc / dc1, dc / dc 2) the maximum output current is limited by the over current protect operation current as shown in below equation. ?? i o max : maximum output current, i limit min : minimum over current protect operation le vel (0.9 a) (1ch is external set) when the i l is low, the inductor core loss (iron loss), the loss due to esr of the ou tput capacitor and the v pp will become low. v pp is expressed as follows: buck mode boost mode ? 8 ?? ( esr : output capacitor equivalence series resistance, c o : output capa citor volume) by using small esr capacitor, v pp voltage level can be lowered. the benefit of ceramics capacitor is low esr and small form factor. the frequency characteristic of esr from the datasheet of the manuf acturer should be confirmed. choose the ceramic capacitor which exhibits low esr in the switching fr equency range that is used on the other hand, dc biasing characteristics of the ceramic capacitor is significant so it needs to be carefu lly examined. for the voltage rating of the ceramic capacitor, twice or more than the maximum output volt age is usually required. by selecting these high voltages rating, it is possible to reduce the influence of dc bias char acteristics. moreover, in order to maintain good temperature characteristics, the one with the characteri stic of x7r or better, is recommended. because the voltage rating of ceramic capacitor is low, the selection becomes difficult in the application with high output voltage. in that case, select electrolytic capacitor. when using electrolytic capacitors, the voltage rating should be 1.2 times or more than the ou tput voltage. electrolytic capacitors have a high voltage rating, large capacity, small amount of dc biasing characteristic, and are generally inexpensive. because typical failure mode is open, it is effect ive to use electrolytic capacitor for applications where high reliability is required such as automotive. on the other han d, disadvantages are relatively high esr and capacitance value drop at low temperatures. in this case, please take note that v pp may increase at low temperature conditions. moreover, consider the lifetime characte ristic of this capacitor. the tantalum capacitor and the conductive polymer capacitor have good temperature characteristics, unlike an electrolytic capacitor. these capacitors have small amount of dc biasing ch aracteristic like the electrolyt ic capacitor. for the voltage rating of the tantalum capacitor, twice or more than the maxi mum output voltage is usually required. for the voltage rating of the conductive polymer capacitor, 1.5 times or more t han the maximum output voltage is usually required. the demerits of tantalum capacitor and conductive polyme r capacitor are that a fault mode is ?sho rt? and voltages rating is low. also the conductive polymer capacitor is expensive. for these reason, these capacitors are not used for automotive applications, because of its high reliability requirements. output capacitors are rated in ripple curren t. the rms values of the ripple electric current obtained in t he next expression must not exceed the ratings of ripple electric current. ? ?? ( i cvo rms : output ripple current rms value) downloaded from: http:///
23/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 when it comes to the capacitance c o , the value needs to be less than the value calculated by the equations below. ~ dc / dc 1 . ~ dc / dc 2 . ( i limit min : minimum over current protect operation curr ent (1ch is external set). 2ch = 0.9 a. soft start min time dc / dc1: 0.5 ms, dc / dc2: 0.4 ms) boot failure may occur if the capacitanc e value exceeds the limits explained above. if the capacitance value is extremely large, over-current protection may be activated by the inrush current at startup, and the output may not start. please confirm this on the actual circuit. capacitance values are critical parameter to determine the lc oscillation fr equency. transient response and loop stability are dependent on the c vo . please select after confirming the setting of the phase compensation circuit. 4. setting the input capacitor c vcca / c vccb , c vs2 value (vcc, vs2) input capacitors reduce the power output impedance that is connected to vcc. two types of capacitors are needed for input capacitor, i.e., decoupling capacitor c vccb and bulk capacitor c vcca . the decoupling capacitors of vcc and vs2 need to be 1 f to 10 f ceramics. the ceramic capacitors are most ef fective when placed as close to vcc and vs2 as possible. at vcc, the cerami c capacitors need to be placed between vcc and gnd and close to pmos and the ground of schottky barrier diode. at vs2, the ceramic c apacitor needs to be placed between vs2 and gnd. voltage rating is recommended to be more than 1.2 times the ma ximum input voltage and twice the normal input voltage. the bulk capacitor prevents line voltage drop and serves as a backup power supply to maintain the input voltage. the low esr electrolytic capacitor with large capacitance is suitable for the bulk capacitor. it is necessary to select the capacitance value which best fits to each application. in case impedance of input side is high such as long wiring between the power supply and vcc, input voltage gets unstable when output impedance of the power supply increases resulting in oscillation or degraded ripple rejection characteristics. large capacitor is needed in this case. it is necessary to verify that the output does not turn off in t he event of vcc drop due to transient in the actual circuit. make sure not to exceed the rated ripple current of the capa citor in this case. the rms of the input ripple current can be obtained from the following equation. downloaded from: http:///
24/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 ~ dc / dc 1 ( i cvccb rms : input ripple current rms value) ~ dc / dc 2 ( i cvs rms : input ripple current rms value) in automotive and other applications requiri ng high reliability, it is recommended t hat capacitors are connected in parallel to reduce the risk of electrolytic capacitors drying out. in ca se of ceramic capacitors, it is recommended make it two in series and two in parallel structures to reduce the risk of destruction due to short circuit event. currently capacitors containing two in series or two in parallel in one package are available in the market so please contact suppliers. 5. setting the input capacitor c vs3 value p l ace a capacitor which is greater than 0.1 f between vs3 and gnd. select the capacitor c onsidering filter circuit for power supply and vs3. since the capacitance value is depende nt on the board layout and pattern, secure enough margin when selecting the capacitor. capacitors that have good voltage and temperature characteristics are recommended. 6. setting the output capacitor c vreg value place a capacitor between the vreg pi n and gnd to avoid oscillation. 0.47 f or greater capacitance is recommended. c vreg can be electrolytic capacitor or cerami c capacitor. secure the capacitance of 0.47 f or greater in the voltage and temperature range in actual operating conditions. the change in capacitance value by temperature may cause oscillation. select the capacitors which have good te mperature characteristics (x7r or bette r), good dc bias characteristics with high voltage rating. in case significant voltage swing and load transient are expected, make sure to carry out thorough evaluation before making a deci sion on the capacitance value. figure 37. vcc pin figure 38. vs2 pin vcc v o1 cvo1 l1 cvccb outh vs2 sw2 vs2 cvs2 l2 v o2 cvo2 downloaded from: http:///
25/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 7. setting the output capacitor c vdd value place a capacitor between vdd and gnd. the capacitance nee ds to be 0.01 f or greater (outl = open) and1 f or greater (outl in use). c vdd can be electrolytic or ceramic. secure high enough capacitance in the voltage and temperature range in actual operating conditions. the change in capacitance value by temperature may cause oscillation. select the capacitors which have good te mperature characteristics (x7r or bette r), good dc bias characteristics with high voltage rating. in case significant voltage swing and load transient are expected, make sure to carry out thorough evaluation before making a deci sion on the capacitance value. 8. setting the internal drive circuit supply capacitor c vl value add the capacitor greater than 0.1 f between vcc and vl. sele ct the capacitor considering the filter circuit for power supply and vl. since the capacitance value is dependent on the board layout and pattern, secure enough margin when selecting the capacitor. 9. setting output voltage (v o1 ) v o2 and v o3 are fixed output while v o1 is adjustable. v o1 output voltage is determined by the following equation. .8 please set feedback resistor rfb1b below 30 k ? to reduce the error margin by the bias current. in addition, since power efficiency is reduced when rfb1a + rfb1b is small, please set the current flowing throug h the feedback resistor small enough as compared to the output current i o1 . 10. selection of the mosfet (m1, m2) in case of buck-boost dc / dc, dc / dc1 needs 2 external mo sfet (pmos = m1 and nmos = m2). in case of buck dc / dc, dc / dc1 needs 1 external mosfet (pmos). key parame ters in choosing mosfet are voltage and current rating. figure 39. select mosfet ( ? ) pmos o v ds maximum rating > vcc o v gs maximum rating > lower value of 13 v or vcc * the voltage between vcc - vl is kept at 10 v (typ), 12 v (max). vl become 0 v when vcc become less than 10.3 v (typ) o allowable current > coil peak current i lmax * a value above the over current protection setting is recommended. * choosing a low on resistance fet results in high efficiency. ( ? ) nmos o v ds maximum rating > v o o v gs maximum rating > vdd o allowable current > coil peak current i lmax * a value above the over current protection setting is recommended. * choosing a low on resistance fet results in high efficiency. downloaded from: http:///
26/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 11. selection of the schottky barrier diode the diode needs to be low vf and fast trr. key parameters in the diode selection are averag e rectified current and dc reverse voltage. average rectified current i f (avg) can be obtained from the following equation: i ??? ( i f avg : average rectified current) the absolute maximum rating of the average rectified cu rrent needs to be 1.2 times or greater than the i f (avg) . the absolute maximum rating of the dc reverse voltage needs to be 1.2 times or greater t han the maximum input voltage. the diode power loss can be obtained by the following equation: ??? ( vf : forward voltage of i o1 (max) ) selecting a diode that has low forward vo ltage and fast reverse recovery time will help achieve a high efficiency. select a diode with 0.6 v or lower forward voltage. the use of the diode greater than 0.6 v forward voltage may cause inner element destruction so care has to be taken. the reverse recove ry time of the schottky barrier diode is so short and thus its switching loss is ignorable. if the diode needs to withstand the event of output short-ci rcuit, absolute maximum ratings and power dissipation need to be even higher. the maximum ra ted current needs to be approx imately 1.5 times of the over current detection value. the diode power loss at the event of output short-circuit can be obtained by the following equation. ? ( i limit max : v o1 maximum over current protect operation current) 12. setting the oscillation frequency (dc / dc1, dc / dc2) the internal oscillation frequency can be set by changing the resistance value connected to rt pin. frequency can be set in the range of 250 khz to 600 khz. the following table shows the resistance value and its corresponding oscillation frequency. switching may stop if the oscillation frequency is set outside of the recommended frequency range and thus normal operation is not guaranteed in such case. rt [k ? ] f osc [khz] 16 697 20 564 27 424 33 350 39 298 47 250 56 211 68 175 figure 40. rt resistance vs. oscillation frequency *the oscillation frequency graph is typical. a certain variation exists in actual usage. 0 100 200 300 400 500 600 700 800 0 2 04 06 08 0 oscillating frequency: fosc [khz] oscillating frequency setting resistance: rrt [k ? ] rt vs fosc downloaded from: http:///
27/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 13. setting the phase compensation circuit (dc / dc1) circuit stability and transient response characteristics are determined by phase compensation. in order to get negative feedback stability, set phase lag when gain 1 (0 db) equal to or less than 135 ? (greater than 45 ? phase margin). good frequency response can be realized by setting higher zero crossing frequency fc (frequ ency at 0 db gain) of the total gain. however, speed and stability are in trade-off relationship. moreover, dc / dc converter application is sampled by switching frequency and the gain of t he switching frequency needs to be suppress ed. in order to do so, zero crossing frequency needs to be set equal to or lower than 1 / 10 of the switching frequency. to improve the responsiveness, switching frequency needs to be raised. it is recommended to draw a bode plot using the transfer function of control loop in order to get a frequency response necessary. please confirm the frequency characteristics of the total gain by comb ining the below three transfer functions. ? g lc : transfer function of lc resonance, g fb : transfer function of phase compensation, g pwm : transfer function of pwm, v ramp : 0.4 v, q : lc quality factor) since dc / dc1 of the bd39001ekv-c is voltage mode, it is possible to add 2-pole and 2-zero compensation as follows. the frequency of zero and pole is determined by the following equations: figure 41. phase compensation circuit (dc / dc1) kkk (a) kkk (b) kkk (c) downloaded from: http:///
28/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 f ? ( dcr : inductor dc resistance, r o : load resistance, r on : mos fet on resistance) the frequency characteristics are optimized by placing pole and zero at most approp riate frequencies. the estimate is as follows. . . . the phase compensation set as explained can cancel out the second order lag (-180 ? ) caused by lc resonance. if f esr is positioned higher than dc / dc switching frequency such as using low esr ceramic for output cap, f p2 is not necessary. if lc filter q (quality factor) is high, the gain has peak and phase rotates too fast resulting in not enough phase margin. in such case, set f z1 and f z2 as close to f lc as possible. q (quality factor) is calculated by following equation: q kkk (d) kkk (e) kkk (f) kkk (g) kkk (h) kkk (i) kkk (j) kkk (k) kkk (l) kkk (m) kkk (n) kkk (o) downloaded from: http:///
29/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 14. phase compensation circuit (dc / dc2) dc / dc2 is current mode control and is 2-pole and 1-zero system. it has two poles formed by error amp and output load and one zero added by phase compensation. the appropriate pole point and zero point placement results in good transient response and stability. generic bode plot of dc / dc converters is shown below. at point (a), gain starts falling due to the pole formed by output impedance of error amp and c co2 capacitance. after that, in order to cancel out the pole formed by output load, insert zero formed by r co2 and c co2 and offset the fluctuation of gain and phase before reaching out to point (b). figure 42. phase compensation level external component values are determined in this way. the r co2 determines the cross over frequency f crs , i.e., the frequency at which dc / dc total gain falls down to 0 db. when f crs is set high, good transient response is expected but stability is sacrificed on the other hand. when f crs is set low, good stability is expected but transient response is sacrificed on the other hand. in this example, component value is set in a way f crs is 1 / 5 to 1 / 10 of the switching frequency. (i) r co2 for phase compensation phase compensation resistor r cmp can be obtained by the following equation. .8 v o2 : output voltage, f crs : cross over frequency, c vo2 : output capacitor, v fb2 : feedback reference voltage (0.8 v (typ)), g mp : current sense gain (16.7 a / v (typ)), g ma : error amp trans-conductance (220 ua / v (typ)) a 00 -90 -180 -90 (a) gbw (b) f crs gain [db] phase[deg] -180 f[khz] phase margin f[khz] ( ? ) downloaded from: http:///
30/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 (ii) c co2 for phase compensation phase compensation capacitor c co2 can be obtained by the following equation. figure 43. phase compensation circuit (dc / dc2) however these are simple equation and thus adjustment of the value using the actual product may be necessary for optimization. also compensation charac teristics are influenced by pcb layout and load conditions and thus thorough evaluation using the production intent unit is recommended. 15. phase compensation circuit (dc / dc1, dc / dc2) the way to start designing phase compensation circuit is as ex plained. create a bode plot and check if targeted frequency characteristics are met. the frequency characteristics pretty much fluct uate depending on pcb layout, type of components used and operating conditions. for instance, using electrolytic capacit or for output stability may cause the shift of lc resonance resulting in oscillation due to the capacitance drop at low temp and relevant esr increase. for phase compensation, temperature compensating type capacit or is recommended. make sure to check stability and responsiveness in actual product. frequency characteristics are checked by gain phase analyzer or fra. ask each vendor fo r measurement method. even you such measurement equipment is unavai lable, phase margin can be estimated fr om transient load response. monitor how the output waveform fluctuates when changing from no l oad to maximum load. if the output fluctuation is significant, response time is slow. if the ringing is frequent, phase margin is not enough. twice or less ringing is appropriate. the phase margin however cannot be quantified in this check method. figure 44. load response v o2 cvo2 dcr l2 sw2 comp2 fb2 0.8v erramp (f) phase margin: little phase margin: good output load output voltage t 0 downloaded from: http:///
31/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 16. phase compensation circuit (ldo3) vo3 pin capacitor the capacitor must be added between vo3 pin and gnd in orde r to stop from having it oscillated and the recommended capacitance value is more than 10uf. in accordance to graph shown in below, either electrolytic or ceramic capacitor can be used. please ensure to select the capacitor higher than 10uf in the range of voltage a nd temperature to be used at. there is possibility of oscillation when capacitance va lue changes due to change of te mperature. when selecting a ceramic capacitor, x7r or higher is recommended which is good in temperature characteristic and has excellent dc bias characteristic. in case significant voltage swing and load tr ansient are expected, make su re to carry out thorough evaluation before making a deci sion on the capacitance value. condition ? vcc = 12 v vs3 = 6.5 v 0 ma i o3 600 ma 10 f c vo3 100 f figure 45. output capacitor value c vo3 vs output capacitor esr figure 46. output capacitor and esr measurement circuit 0.01 0.1 1 10 100 10 22 33 47 68 100 esr[ohm] c vo3 [uf] c vo3 vs. esr downloaded from: http:///
32/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 17. provision of capacitor connected to cl terminal the capacitor (ccl) and resistor (rclb) co nnected to cl pin are the cr noise filt er for preventing ocp error detection. for the constant setting of filter, since noise depends on circuit and board pattern, there is no fixed rule. but, please try reducing cut-off frequency of cr filter without deteriorating on pulse waveform that requires detecting current sense. pulse width (v o1 / v cc ) ~ (1 / f osc ) ( the rough estimate setting is r clb = several tens ohm, c cl = several thousand pf) figure 47. cl pin filter circuit 18. soft start setting the soft start function is necessary to prevent inrush of coil current and output volt age overshoot at start up. setting of soft start time is shown in the following equation. ~ dc / dc1 ~ dc / dc2 rclb ccl cl vcc outh rcla downloaded from: http:///
33/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 19. setting the ct power on reset time power reset setting time can be set by the capacitor connected to ct capacitance can be chosen from 0.01 f to 1 f range or have ct terminal open. if setting is made out of its range, chattering may occur at reset output. ct operation is changed by the time of error detection. see page 13, figure 14 for detail. (1) ct pin starts 0 v figure 48. power on reset time1 (ct = 0 v to 0.8 v (typ)) (2) ct pin starts 0.2 v figure 49. power on reset time2 (ct = 0.2 v (typ) to 0.8 v (typ)) ct [ f] por [ms] 0.001 0.167 0.0082 1.09 0.01 1.62 0.022 3.46 0.033 5.24 0.047 7.64 0.068 10.8 0.1 16 0.22 36.2 0.47 76.8 1 159 2.2 360 10 1810 ct [ f] por [ms] 0.001 0.16 0.0082 0.826 0.01 1.452 0.022 2.51 0.033 3.93 0.047 5.82 0.068 7.9 0.1 14.12 0.22 26.7 0.47 57.2 1 114.4 2.2 244 10 1240 0 20 40 60 80 100 120 140 160 180 200 0 0.3 0.6 0.9 power on reset time: por[ms] por setting capacitor: cct[ f] ct vs por 0 20 40 60 80 100 120 140 160 180 200 00 . 30 . 60 . 9 power on reset time: trst[ms] por setting capacitor: cct[ f] ct vs trst downloaded from: http:///
34/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 20. setting the wdt oscillation frequency wdt oscillation frequency can be set by resistance value connected to rtw. possible setting range is 50 khz to 25 0 khz and the relation between resistance value and oscillation frequency is decided as shown below. it is possible that the switching stops at outside these range and its operation is not gu aranteed. figure 50. wdt oscillation frequency characteristics r tw [k ? ] f oscw [khz] 12 393 18 268 22 221 27 182 33 151 47 108 51 100 62 83 75 69 82 64 100 53 120 45 150 36 *this oscillation frequency graph is typical value tolerance needs to be put into consideration. 0 50 100 150 200 250 300 350 400 450 04 08 01 2 01 6 0 wdtoscillating frequency: foscw [khz] oscillating frequency setting resistance: rrtw [k ? ] rtw vs fosc downloaded from: http:///
35/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 21. recommend value of external pull - up resistance pg pin on resistance (ppupg) min = 0.5 k ? , typ = 1.0 k ? , max = 2.0 k ? (v) please set the resistance value considering h threshold of pg pin. figure 51. 22. provision of en1 pull -up resistance because "h" threshold of en1 is min 2.5 v, please design as the below equation is able to work. . (v) (188 k ? r en1b 750 k ? ) figure 52 ren1a ren1b en vcc downloaded from: http:///
36/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 application examples *there are many factors (board layout, variation of t he part, etc.) that can affe ct the characteristics. please verify and confirm using practical applications. *no connection (n.c) pin should not be connected to any other lines. *be sure to connect the test pin to ground. * if en1 pin is connected to vcc pin, please insert resistance between the pins. figure 53. application example 2 (dc / dc1 buck - boost) downloaded from: http:///
37/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 application examples - continued *there are many factors (board layout, variation of t he part, etc.) that can affe ct the characteristics. please verify and confirm using practical applications. *no connection (n.c) pin should not be connected to any other lines. *be sure to connect the test pin to ground. * if en1 pin is connected to vcc pin, please insert resistance between the pins. figure 54. application example 3 (dc / dc1 buck) # # # _ downloaded from: http:///
38/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 example of constant setting (dc / dc1 buck mode) name value parts no. size code maker note ic - - bd39001ekv-c 10 10 mm rohm ren 150 kohm mcr03 1608 rohm rrt 27 kohm mcr03 1608 rohm rfb1a 10 kohm mcr03 1608 rohm rfb1b 68 kohm mcr03 1608 rohm rfb1c 1.6 kohm mcr03 1608 ro hm at buck-boost: 0.1 kohm rco1 36 kohm mcr03 1608 rohm at buck-boost: 4.7 kohm rco2 20 kohm mcr03 1608 rohm rrtw 47 kohm mcr03 1608 rohm rcla 110 mohm mcr10 2012 rohm rclb 110 mohm mcr10 2012 rohm rrst2 10 kohm mcr03 1608 rohm rrst3 10 kohm mcr03 1608 rohm rrstw 10 kohm mcr03 1608 rohm rpupg1 10 kohm mcr03 1608 rohm rpupg2 10 kohm mcr03 1608 rohm rpupg3 10 kohm mcr03 1608 rohm cvcca 47 f electrolytic capacitor - - cvccb 2.2 f gcm31cr71h225ka40 1608 murata cvreg 1 f gcm188r71c105ka49 1608 murata cvdd 0.1 f gcm188r11h104ka42 1608 murata at buck-boost: 1 f css1 0.033 f gcm188r11h333ka40 1608 murata css2 0.047 f gcm188r11h473ka40 1608 murata cco1a 2200 pf gcm188r11h222ka01 1608 murata at buck-boost: 47000 pf cco1b 33 pf gcm188r11h330ka01 1608 murata at buck-boost: 100 pf cco2 2200 pf gcm188r11h222ka01 1608 murata cvs3 1 f gcm188r71c105ka49 1608 murata ccl 0.1 f gcm188r11h104ka42 1608 murata cvl 0.1 f gcm188r11h104ka42 1608 murata cvo1a 100 f electrolytic capacitor - - at buck-boost: 47 f cvo1b open - - - at buck-boost: 44 f cvs2 4.7 f gcm21br71c475ka67 2012 murata cvo2 100 f electrolytic capacitor - - cvo3 100 f electrolytic capacitor - - cct 0.1 f gcm188r11h104ka42 1608 murata l1 47 h slf12565t-470m2r4-h 12.5 12.5 mm tdk l2 10 h slf7045t-100m1r8-h 7 7 mm tdk d1a sbd rb050l-40 rohm d1b sbd rb050l-40 rohm only buck-boost m1 pchfet rsd046p05 rohm m2 nchfet rsd080n06 rohm only buck-boost notes for pattern layout of pcb 1) design the wirings shown in bold line as short as possible. 2) place the input ceramic capacitor cvccb as close to m1 as possible. 3) place the rrt and rrtw as cl ose to gnd pin as possible. 4) place the rfb1a and rfb1b as close to fb1 pin as po ssible and provide the shorte st wiring from fb1 pin. 5) place the rfb1a, rfb1b and fb2 as far away from l1 and l2 as possible. 6) separate power gnd and signal gnd so that sw noise doesn?t affect the signal gnd. downloaded from: http:///
39/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 sequence function dc / dc2 and ldo output sequence can be se t with en2, en3, seq2 and seq3 pin. ex. 1) en2, en3, seq2 and seq3 pins are open dc / dc1 ldo and dc / dc2 start at once. figure 55. start sequence example 1 ex. 2) condenser connects to en pin figure 56. start sequence example 2 , _ lvd2 dc / dc2) lvd3 ldo) dc / dc2 ldo downloaded from: http:///
40/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 power dissipation maximum junction temperature tj is 150 c. if the junction tem perature reaches 175 c or higher, the circuit will be shut down. please make sure that the junction te mperature must not exceed 150c at all time. for thermal design, be sure to operate the ic within the following conditions. (since the temperatures described hereunder are all guaranteed temperatures, take margin into account.) 1. ambient temperature ta is less than 125 c. 2. tj is less than 150 c. temperature tj can be calculated by two ways as below. 1. to obtain tj from the ic surface te mperature tc in actual use 2. to obtai n tj from the ambient temperature ta the heat loss of the ic (p total ) is calculated by the equation below. ~ dc / dc1 (at buck) ~ dc / dc2 C toff f i / ~ ldo C ~ dc / dc1 figure 57. sw1 wave form ? ? ? downloaded from: http:///
41/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 ~ dc / dc2 figure 58. sw2 wave and circuit ? the loss of on duty ? the loss of off duty C ? the loss of off / off vf toff f ? the loss of tr 2 tr ? the loss of tf 2 tf r onh1 : on resistor of external pch-powtr r onh2 : on resistor of internal pch-powtr r onl2 : on resistor of internal nch-powtr v o1 : dc / dc1 output voltage v o2 : dc / dc2 output voltage v o3 : ldo output voltage v cc : input voltage (vs2 = v o1 , vs3 = v o1 ) io 1 : dc / dc1 output current io 2 : dc / dc2 output current io 3 : ldo output current i cc : circuit current (see page 5) tr 1 : switching rise time (about15 ns) tr 2 : switching rise time (about15 ns) tf 1 : switching fall time (about 35 ns) tf 2 : switching fall time (about15 ns) toff2: dc / dc2 dead time (about 65 ns) f: oscillation frequency see the thermal derating characteristi cs (figure 59) if the device used over the ambient temperature ta = 25 c. the characteristics of ic largely depend on temperature, and ic must be used at maximum junction temperature (tjmax) or lower. even if the ambient temperature is 25 c, there is a po ssibility junction temperature gets high as consequence of input voltage and load current. ic must be used within power dissipation pd. thermal resistance value ja is varied by the number of the la yer and copper foil area of the pcb. see figure 59 for the thermal design. downloaded from: http:///
42/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 thermal derating characteristics ic mounted on rohm standard board ~ board size: 70 mm 70 mm 1.6 mm ~ pcb and back metal are connected by soldering ? 1 layer board 70 70 1.6 mm (copper foil area 0 mm 0 mm) ? 2 layer board 70 70 1.6 mm (copper foil 15 mm 15 mm) ? 2 layer board 70 70 1.6 mm (copper foil 70 mm 70 mm) ? 4 layer board 70 70 1.6 mm (copper foil 70 mm 70 mm) board ? : ja = 89.3 c / w board ? : ja = 69.4 c / w board ? : ja = 34.7 c / w board ? : ja = 25.0 c / w figure 59. package data of htqfp48v (reference data) 0 1 2 3 4 5 6 0 2 55 07 51 0 01 2 51 5 0 power dissipation : pd w) ambient temperature: ta( ? ) ? 5.00 w ? 3.60 w ? 1.80 w ? 1.40 w downloaded from: http:///
43/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 i / o equivalence circuit 1. vo3 3. vs3 4, 5. vs2 7, 8. sw2 10, 11. pgnd2 12. ss2 13. comp2 14. fb2 15. vdd 16. outl 17. pgnd1 19. vl downloaded from: http:///
44/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 i / o equivalence circuit - continued 21. outh 23. cl 24. vcc 25. en1 26. t4 27. vreg 28. ss1 29. comp1 30. fb1 31. rt 33, 34 rst2#, rst3# 35. rstwd# downloaded from: http:///
45/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 i / o equivalence circuit - continued 36. ct 37. rtw 38. clk 39. enwd 40. en3 41. en2 42, 43, 44, 45, 46 seq3, seq2, pg3, pg2, pg1 47. t3 48. sel_uvlo _ downloaded from: http:///
46/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can da mage the ic. please make sure to have protection against reverse polarity, such as putting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines power supply line must be low impedance on the pcb. t he power supply of digital and analog must be separated (even if the electrical potentials ar e the same) to prevent analog circuit from having digital noise by common impedance of line pattern (ground line must be designed in the same way) furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when usi ng electrolytic capacitors. 3. ground voltage ensure that ground pin must have the lowest electrical potential at all time even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces shou ld be routed separately, but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground voltage caused by large current s. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd is s pecified at the condition of 70mm x 70mm x 1.6mm glass epoxy board. in case of exc eeding this absolute maximum rating, increase the board size or copper area to prevent the ic from exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the spec ified characteristics can be approximately obtained. the electrical characteristics are guaran teed under the specified conditions. 7. inrush current when power is first supplied to the ic, it is possible that t he internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special cons ideration to power coupling capacitance, powe r wiring, width of ground wiring, and routing of connections. 8. testing on application boards when testing the ic on an application b oard, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removi ng it from the test setup dur ing the inspection process. to protect ic from static discharge damage, ground the ic dur ing assembly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. make sure that there is nothing between the pins, such as no metal particles, no water droplets (in very humid environment) and unintentional solder bridge deposited. downloaded from: http:///
47/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 operational notes ? continued 10. unused input pins input pins of an ic are often connec ted to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if input pins left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 11. regarding the input pin of the ic this monolithic ic contains p+ isol ation and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction o perates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions t hat cause these diodes to operate, such as applying a voltage lowe r than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. in the construction of this ic, p-n junc tions are inevitably formed creating parasi tic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operat e, such as applying a voltage to an input pin lower than the ground voltage should be avoi ded. furthermore, do not apply a volt age to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in t he electrical characteristics of this ic. 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric cons tant with the consideratio n of the capacitance charge with temperature and the decrease in nomin al capacitance due to dc bias and others. 13. thermal shutdown circuit (tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period of time, the junction temperature (tj) rises, and tsd activated, which turns off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute ma ximum ratings. under no circumstances, tsd circuit should not be used for any purpose other than protecting the ic from exceeding the maximum rating. 14. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is ac tivated when the load is shorted. this protection circuit is designed to avoid ic damaged from sudden and unexpected incidents, so should not be used in applications characterized by continuous opera tion or transitioning of the protection circuit. 15. power input at shutdown if vcc starts up in rapid period of time at shutdown (en1 = off), vreg voltage may be output, which causes the ic to malfunction. therefore, set the vcc rise time at 40v/ms or shorter. downloaded from: http:///
48/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 16. reverse polarity and surge voltage z if the vcc and pin potential are reversed, internal circui t or element may be damaged (example: vcc is shorted to gnd while external capacitor changed) putting diode for reve rse protection in series of vcc or putting bypass diode between vcc is recommended. z if the vs2 and pin potential are reversed, internal circ uit or element may be damaged (example: vcc is shorted to gnd while external capacitor changed) putting diode for reve rse protection in series of vcc or putting bypass diode between vcc is recommended. z if the vs3 and pin potential are reversed, internal circ uit or element may be damaged (example: vcc is shorted to gnd while external capacitor changed) putting diode for reve rse protection in series of vcc or putting bypass diode between vcc is recommended z applying positive surge to the vcc if there is apossibility a surge exceeding the rating be applied to vcc, please put a power zener diode between vcc and gnd. vs3 downloaded from: http:///
49/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 z applying negative surge to the vcc if there is a possibility vcc gets lower than g nd, please put a schottky diode between vcc and gnd. z protection diode if there is a possibility large inductive load is connected to the output pin (vo2 or vo3) resulting in back-emf at time of startup and shutdown, a protec tion diode should be placed as shown in the figure below. downloaded from: http:///
b d ? 2 w w ts z p h p d 39001e k 2 014 rohm co w w.rohm.com z 22111 ? 15 ? 0 h ysical dim e p ackage n a kv -c o ., ltd. all rights 0 01 e nsion, tap e a me reserved. e and reel i nformation 50/52 h t t qfp48v tsz apr. 7 z 02201-0t3 t datash e datasheet 7 .2014 rev. 0 t 0am00120- e et datasheet 0 01 1-2 downloaded from: http:///
51/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 ordering information b d 3 9 0 0 1 e k v - c ? e 2 part numbe r package ekv: htqfp48v for in-vehicle packaging and forming specification e2: embossed tape and reel marking diagram htqfp48v (top view) bd39001 part number marking lot numbe r 1pin mark downloaded from: http:///
52/52 datasheet datasheet bd39001ekv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 apr.7.2014 rev.001 tsz02201-0t3t0am00120-1-2 revision history date revision changes 2014.apr.7 001 new release downloaded from: http:///
datasheet datasheet notice ? ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice ? ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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